Recent advances in method of suppressing dendrite formation of tin-based solder alloys

Bokai Liao, Hong Wang, Weiping Xiao, Yu Cai, Xingpeng Guo

2020Journal of Materials Science Materials in Electronics29 citationsDOI

Topics & Concepts

TinMaterials scienceSolderingDendrite (mathematics)DissolutionMetallurgyElectrolyteAnodeElectronicsElectrodeChemical engineeringElectrical engineeringChemistryMathematicsEngineeringGeometryPhysical chemistryElectronic Packaging and Soldering TechnologiesSemiconductor materials and interfacesCopper Interconnects and Reliability