Thermal fatigue failure mechanism in the joint of nano Cu/Ti–Si3N4 ceramic substrates after thermal fatigue test
Chenglai Xin, Mingchang Zhang, Qingyuan Wang, Dongya Li, Zhenliang Ma, Zhaoguo Yuan
Topics & Concepts
Materials scienceCeramicCorrosionComposite materialLayer (electronics)ThermalMicrostructureNano-Thermal expansionStress (linguistics)Joint (building)MetallurgyStructural engineeringMeteorologyPhilosophyEngineeringPhysicsLinguisticsAdvanced ceramic materials synthesisAluminum Alloys Composites PropertiesAdvanced materials and composites