Enhancement of anti-oxidation and tensile strength of nanotwinned Cu foils by preferential Ni electrodeposition
Kang-Ping Lee, Dinh-Phuc Tran, Bo-Yan Chen, Yi-Quan Lin, Chen-Ning Li, Jian-Yuan Huang, Hsuan-Chih Chen, R.S. Chen, Chih Chen, R.S. Chen, R.S. Chen, Chih Chen
Topics & Concepts
Ultimate tensile strengthCopperMaterials scienceMetallurgyChemistryChemical engineeringEngineeringElectrodeposition and Electroless CoatingsSemiconductor materials and interfacesSemiconductor materials and devices