Kinetics of indium and indium–tin soldering materials in vacuum volatilization
Jian Pang, Lingxin Kong, Bin Yang, Zhicheng Yang, Wu Hai, Wei Zhao, Jiapeng Zhang, Junjie Xu, Baoqiang Xu
Abstract
Vacuum volatilization is a clean and efficient method for metal purification, alloy separation, and comprehensive recovery of secondary resources. The evaporation kinetics of In and In–Sn alloys were investigated to better understand the evaporation mechanism during the vacuum volatilization of In. The evaporation rates of the In and In–Sn alloys at 1173–1373 K and 5 Pa increased significantly with increasing temperature in accordance with the equation ω = e(a+b∙T). The evaporation rates at 1323 K and 5 Pa decreased with increasing crucible depth in accordance with the equation ω = a2+(a1-a2)/(1+e(h-b)/c). For In and In–Sn, the total mass-transfer coefficients of In were obtained at different temperatures and crucible depths. A theoretical kinetic model of In was established and limiting links were obtained vacuum volatilization of In and In–Sn.