Microstructure evolution and deformation behaviour of Sn-xBi-1Ag Solder alloys: Influences of Bi content
Xiaojun Hu, Wei Sun, Jiali Liao, Jingwei Xian, Guang Zeng
Topics & Concepts
Materials scienceMicrostructureSolderingDeformation (meteorology)MetallurgyContent (measure theory)Composite materialMathematicsMathematical analysisElectronic Packaging and Soldering Technologies3D IC and TSV technologiesMetallurgical and Alloy Processes