Work of adhesion and reactive wetting in SnPb/Cu,Ni and SnBi/Cu,Ni soldering systems
Samuel Griffiths, Andre Wedi, Guido Schmitz
Topics & Concepts
WettingSessile drop techniqueSolderingIntermetallicMaterials scienceContact angleSurface tensionAdhesionMetallurgyComposite materialWork (physics)BrazingThermodynamicsAlloyPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties