2D material integrated photonics: Toward industrial manufacturing and commercialization
Yuning Zhang, Jiayang Wu, Junkai Hu, Linnan Jia, Di Jin, Baohua Jia, Xiaoyong Hu, David Moss, Qihuang Gong
Abstract
On-chip integration of 2D materials with exceptional optical properties provides an attractive solution for next-generation photonic integrated circuits to address the limitations of conventional bulk integrated platforms. Over the past two decades, significant advancements have been made in the interdisciplinary field of 2D material integrated photonics, greatly narrowing the gap between laboratory research and industrial applications. In this paper, we provide a perspective on the developments of this field toward industrial manufacturing and commercialization. First, we review recent progress toward commercialization. Next, we provide an overview of cutting-edge fabrication techniques, which are categorized into large-scale integration, precise patterning, dynamic tuning, and device packaging. Both the advantages and limitations of these techniques are discussed in relation to industrial manufacturing. Finally, we highlight some important issues related to commercialization, including fabrication standards, recycling, service life, and environmental implications.