Flexible Encapsulation and Module of Thin‐Film GaInP/GaAs/InGaAs Solar Cells
Jingjing Xuan, Junhua Long, Qiangjian Sun, Yi Zhang, Xuefei Li, Xia Wang, Zhitao Chen, Xiaoxu Wu, Shulong Lu
Abstract
Lightweight and flexible III–V solar cells create new opportunities for application in satellites, drones, and wearable devices. In this article, a module manufacturing scheme based on resistance welding and lamination technology is proposed to meet the demands of practical application. A combined laminate structure of ethylene–tetrafluoroethylene plus ethylene octene copolymer and polyimide is used to encapsulate flexible III–V solar cells. In laboratory measurements with a spectrum close to AM1.5G, the photoelectric conversion efficiency of the flexible solar cell is 34.4% with an open‐circuit voltage of 3.04 V, and the efficiency of the flexible module is 32.7% with a weight density of 469 g m −2 . The electroluminescence measurements show good performance of the flexible solar cell module, which is expected to achieve large‐size flexible III–V solar cells encapsulation.