Role of resin percolation in gap filling mechanisms during the thin ply thermosetting automated tape placement process
Pavel Šimáček, Navid Niknafs Kermani, Verena Gargitter, Suresh G. Advani
Topics & Concepts
Thermosetting polymerMaterials scienceComposite materialWavinessConsolidation (business)Deformation (meteorology)Bridging (networking)Percolation thresholdPorosityPercolation (cognitive psychology)Electrical resistivity and conductivityComputer scienceBusinessBiologyNeuroscienceEngineeringComputer networkAccountingElectrical engineeringEpoxy Resin Curing ProcessesMaterial Properties and ProcessingComposite Material Mechanics