Unraveling the surface behavior of amino acids on Cu wiring in chemical mechanical polishing of barrier layers: A combination of experiments and ReaxFF MD
Tengda Ma, Shihao Zhang, Yi Xu, Baimei Tan, Wei Li, Jinbo Ji, Lei Guo
Topics & Concepts
ReaxFFCopperChemical-mechanical planarizationAdsorptionTriethylenetetramineMoleculeChemistryChelationInorganic chemistryChemical engineeringOrganic chemistryHydrogen bondLayer (electronics)EngineeringAdvanced Surface Polishing TechniquesMetal Extraction and BioleachingCorrosion Behavior and Inhibition