Multi-phase-field modelling of electromigration-induced void migration in interconnect lines having bamboo structures
Akimitsu Ishii, Akinori Yamanaka
Topics & Concepts
ElectromigrationVoid (composites)InterconnectionMaterials scienceComposite materialEngineeringTelecommunicationsCopper Interconnects and ReliabilityAluminum Alloy Microstructure PropertiesElectronic Packaging and Soldering Technologies