Microfluidic electroless deposition for uniform stacking chip interconnection: Simulation framework and experimental validation
Yonglin Zhang, Peilun Yao, Yuzi Han, Jun Yang, Jun Yang, Haibin Chen, Jingshen Wu, Jinglei Yang, Jinglei Yang
Topics & Concepts
InterconnectionDeposition (geology)Materials scienceSubseaStackingFlow (mathematics)MicrochannelElectroplatingChipMicrofluidicsVolumetric flow rateWork (physics)NanotechnologyMechanicsMechanical engineeringElectronic engineeringComputer scienceChemistryEngineeringElectrical engineeringPhysicsMarine engineeringLayer (electronics)PaleontologyBiologyComputer networkOrganic chemistrySediment3D IC and TSV technologiesSemiconductor materials and devicesElectronic Packaging and Soldering Technologies