Three-dimensional fluid-thermal–mechanical coupling numerical modeling of elastocaloric cooler for electronic chip
Xingkun Dong, Xiangjun Jiang, Peng Li, Yong Mi, Qi Liu
Topics & Concepts
Coupling (piping)Materials scienceThermalChipMechanical engineeringThermal management of electronic devices and systemsMechanicsThermodynamicsEngineeringComposite materialPhysicsElectrical engineeringHeat Transfer and OptimizationThermal Expansion and Ionic ConductivityThermal properties of materials