Partial Segregation of Bi and Microvoid Formation on a Pure Cu Substrate After Solid–Solid Reactions
Yi-Wun Wang, Hua-Tui Liang, Kai-Chia Chang, Guo-Wei Wu, Tzu-Ting Tseng, Yi Chen
Topics & Concepts
SolderingMaterials scienceSemiconductorProcess (computing)Substrate (aquarium)SolubilityInterface (matter)Solid-state physicsCarbon fibersSolid solutionEngineering physicsComposite materialMetallurgyOptoelectronicsComputer scienceChemistryCondensed matter physicsWettingPhysical chemistryGeologyOperating systemPhysicsOceanographyEngineeringSessile drop techniqueComposite numberElectronic Packaging and Soldering Technologies3D IC and TSV technologiesSemiconductor materials and interfaces