Defect inspection of flip chip solder joints based on non-destructive methods: A review
Lei Su, Xiaonan Yu, Ke Li, Michael Pecht
Topics & Concepts
Flip chipSolderingJoint (building)Materials scienceThermal copper pillar bumpChipMechanical engineeringElectronic engineeringStructural engineeringEngineeringElectrical engineeringComposite materialLayer (electronics)AdhesiveIntegrated Circuits and Semiconductor Failure AnalysisElectronic Packaging and Soldering TechnologiesIndustrial Vision Systems and Defect Detection