Recycled low-temperature direct bonding of Si/glass and glass/glass chips for detachable micro/nanofluidic devices
Chenxi Wang, Hui Fang, Shicheng Zhou, Xiaoyun Qi, Fanfan Niu, Wei Zhang, Yanhong Tian, Tadatomo Suga
Topics & Concepts
Anodic bondingMaterials scienceAnnealing (glass)SiliconComposite materialDirect bondingNanotechnologyBonding strengthVoid (composites)Optoelectronics3D IC and TSV technologiesNanofabrication and Lithography TechniquesNanowire Synthesis and Applications