Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging
Chengming Li, Shujin Chen, Shanshan Cai, Jubo Peng, Xiaojing Wang, Yingwu Wang
Topics & Concepts
MicrostructureMaterials scienceIsothermal processSolderingEutectic systemComposite materialIntermetallicJoint (building)Shear strength (soil)Ball grid arrayMetallurgyAlloyStructural engineeringThermodynamicsSoil scienceEnvironmental scienceSoil waterEngineeringPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties