Impact of Co on Thermal Aging in Sn58Bi/Cu Solder Joints: IMC Growth and Transformation in Mechanical Properties
Xi Huang, Liang Zhang, Li-bin Rao, Lei Sun
Topics & Concepts
SolderingTransformation (genetics)Materials scienceMetallurgyThermalChemistryThermodynamicsPhysicsGeneBiochemistryElectronic Packaging and Soldering Technologies3D IC and TSV technologiesMetallurgical and Alloy Processes