Two-phase active immersion cooling for vertically mounted electronics with interchip component-assisted bubble departure
Faizan Ejaz, Beomjin Kwon
Topics & Concepts
BubbleImmersion (mathematics)Materials scienceElectronicsComponent (thermodynamics)Phase (matter)Electronics coolingElectronic componentMechanicsNuclear engineeringMechanical engineeringThermodynamicsHeat transferElectrical engineeringPhysicsPure mathematicsEngineeringMathematicsQuantum mechanicsHeat Transfer and Boiling StudiesHeat Transfer and OptimizationRefrigeration and Air Conditioning Technologies