Interfacial Bonding Improvement through Nickel Decoration on Carbon Nanotubes in Carbon Nanotubes/Cu Composite Foams Reinforced Copper Matrix Composites
Dan Wang, An Yan, Yichun Liu, Zhong Wu, Xueping Gan, Fengxian Li, Jingmei Tao, Caiju Li, Jianhong Yi
Abstract
Inhomogeneous structures with carbon nanotubes (CNTs), reinforced with Cu composite foams as the reinforcing skeletons (CNTs/Cuf®Cu), have been designed to overcome the paradox between strength and ductility or conductivity in copper matrix composites. The interface between CNTs and the copper matrix is usually weak, due to poor wettability and interaction. In this study, nickel nanoparticles are decorated onto CNTs to improve interfacial bonding. The broader interface transition area between CNTs and copper with Ni3C interfacial products formed, and a combination of improved electrical conductivity (95.6% IACS), tensile strength (364.9 MPa), and elongation (40.6%) was achieved for the Ni-decorated CNTs/Cuf®Cu (Ni-CNTs/Cuf®Cu). In addition, the strengthening mechanisms are discussed in this study.