Molecular dynamics study of deformation mechanism of interfacial microzone of Cu/Al <sub>2</sub> Cu/Al composites under tension
Yao Chen, Aiqin Wang, Zishuo Guo, Jingpei Xie
Abstract
Abstract The micromechanical behavior of an Al/Al 2 Cu/Cu multilayer with characteristic crystal orientation during uniaxial tensile deformation was investigated by molecular dynamics. The simulation results showed that under tensile loading, the dislocation nucleates at the Cu/Al 2 Cu heterogeneous interface and moves toward the Cu layer along the {111} crystal plane. The deformation mechanism is intralayer confinement slip. As the dislocations proliferated, interactions between them occurred; resulting in the formation of insertion stacking faults and deformation twins in the Cu and Al layers. However, no dislocation lines were generated in the Al 2 Cu layer during tensile deformation. As the load increased, the stress concentration at the Al 2 Cu/Al interface led to the fracture of the complex. In addition, the microplastic deformation mechanism and mechanical properties of Al/Al 2 Cu/Cu composites at different temperatures and strain rates were significantly different. These results revealed the microdeformation mechanism of laminated composites containing brittle phases.