High-strength and high-conductivity nanotwinned Cu lightly doped with Ni
Kang-Ping Lee, Bo-Yan Chen, Yi-Quan Lin, Yu‐Wen Hung, Wei-You Hsu, Yun-Hsuan Chen, Chih Chen, Yun-Hsuan Chen, Chih Chen
Topics & Concepts
Materials scienceMicrostructureUltimate tensile strengthCopperMetallurgyAlloyElectrical resistivity and conductivityGrain sizeDopingConductivityMechanical strengthComposite materialOptoelectronicsChemistryEngineeringElectrical engineeringPhysical chemistryMicrostructure and mechanical propertiesCopper Interconnects and ReliabilityElectrodeposition and Electroless Coatings