Expanding Design Technology Co-Optimization Potentials with Back-Side Interconnect Innovation
Byung‐Sung Kim, Subin Choi, Jung Han Lee, Kwangmuk Lee, Jisoo Park, Jiwook Kwon, Saehan Park, Kwanyoung Chun, Harsono Simka, Aravindh Kumar, Muhammed Ahosan Ul Karim, K. Rim, Jaihyuk Song
Abstract
This report analyzes the benefits obtained through Back-Side Interconnect (BSI) technology, encompassing Back-Side Power Delivery Network (BSPDN) and Back-Side Signal (BSS), from the perspective of Design-Technology Co-Optimization (DTCO). Through BSPDN, benefits such as metal pitch relaxation and/or cell height reduction can be achieved. Additionally, the implementation of BSS technology allows for intra-cell and inter-cell routing on the back side, leading to improved speed and greater reduction in cell area.
Topics & Concepts
InterconnectionComputer scienceElectronic engineeringEngineeringTelecommunications3D IC and TSV technologiesManufacturing Process and OptimizationVLSI and FPGA Design Techniques