Effect of voids on thermomechanical cracking in lead-free Sn3Ag0.5Cu interconnections of power modules
J. Hagberg, Olli Nousiainen, Jussi Putaala, Olli Salmela, Juha Raumanni, Matti Rahko, T. Kangasvieri, Jussi Jääskeläinen, Timo Galkin, Heli Jantunen
Topics & Concepts
Materials scienceSolderingVoid (composites)CrackingComposite materialCreepIntergranular corrosionInterconnectionViscoplasticityRecrystallization (geology)Structural engineeringFinite element methodMicrostructureConstitutive equationPaleontologyBiologyComputer scienceComputer networkEngineeringElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisAluminum Alloy Microstructure Properties