Study on the microstructure and mechanical property of Cu-foam modified Sn3.0Ag0.5Cu solder joints by ultrasonic-assisted soldering
Xiong Yi, Ruhua Zhang, Xiaowu Hu
Topics & Concepts
SolderingMaterials scienceComposite materialMicrostructureSolder pasteShear strength (soil)IntermetallicMetallurgyUltrasonic sensorLayer (electronics)BrittlenessAlloyAcousticsSoil waterSoil sciencePhysicsEnvironmental scienceElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis