Temperature field in the crack-free ductile dry grinding of fused silica based on wheel wear topographies
Wei Wang, Zhipeng Li, Hang Yin, Shuo Chen, Shimeng Yu, Peng Yao
Topics & Concepts
Materials scienceGrindingComposite materialField (mathematics)Dry frictionMetallurgyMathematicsPure mathematicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationLaser Material Processing Techniques