Fabrication of Cu@Sn TLPS joint for high temperature power electronics application
Honghui Zhang, Hongyan Xu, Xuan Liu, Ju Xu
Abstract
Sn joints and the other Cu/Sn system TLPS joints. The high shear strength, high thermal conductivity and high melting temperature demonstrate that Cu@Sn TLPS joint is a promising interconnect technology for high power density modules.
Topics & Concepts
FabricationElectronicsJoint (building)Power electronicsMaterials scienceNanotechnologyOptoelectronicsPower (physics)Engineering physicsElectrical engineeringEngineeringPhysicsThermodynamicsArchitectural engineeringAlternative medicinePathologyMedicineElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability