Preparation, characterization and mechanical properties analysis of SAC305-SnBi-Co hybrid solder joints for package-on-package technology
Shuai Zhang, Shuai Zhang, Xinyi Jing, Jieshi Chen, Kyung-Wook Paik, Peng He, Shuye Zhang, Shuye Zhang
Topics & Concepts
Materials scienceSolderingIntermetallicComposite materialMicrostructureWettingMonoclinic crystal systemShear strength (soil)MetallurgyCrystal structureCrystallographyAlloyChemistrySoil scienceEnvironmental scienceSoil waterElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties