Phase‐field simulation of microscale crack propagation/deflection in SiC <sub>f</sub> /SiC composites with weak interphase
Jin Gao, Yuelei Bai, Haolong Fan, Guangping Song, Xiaocan Zou, Yongting Zheng, Xiaodong He
Abstract
Abstract To understand the microscale toughening mechanism, the crack propagation, and stress–strain response of unidirectional SiC f /SiC composites with h‐BN interphase under transverse and longitudinal tension are investigated by a promising micromechanical phase field (PF) method along with representative volume element. Of much interest, the calculation results are well consistent with the available experimental results. With a strong dependence on the interphase strength, the toughening mechanisms during crack propagation are well presented, for example, fiber pull‐out, crack deflection, and interphase debonding. Furthermore, the longitudinal tensile strength of SiC f /SiC composites increases with decreasing the interphase strength, where only a weak enough interphase can result in a significant crack deflection by its cracking. In particular, the ratio of the interphase strength along fibers to the matrix strength should be less than 1.254 to ensure crack deflection in the interphase and fiber pull‐out. Moreover, the transverse tensile strength of SiC f /SiC composites reaches a maximum with increasing the interphase thickness into the range of 0.25–0.5 µm.