Copper-incorporated dendritic mesoporous silica nanospheres and enhanced chemical mechanical polishing (CMP) performance via Cu2+/H2O2 heterogeneous Fenton-like system
Yang Chen, Aoli Wei, Xiangyu Ma, Wang Tianyu, Ailian Chen
Topics & Concepts
Chemical-mechanical planarizationMaterials scienceCopperPolishingChemical engineeringMesoporous materialNanocrystalMesoporous silicaFourier transform infrared spectroscopyNanoparticleNanotechnologyCatalysisComposite materialMetallurgyChemistryOrganic chemistryEngineeringAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchSemiconductor materials and devices