Investigating the partial plastic formation mechanism of typical scratches on silicon wafers induced by rogue particles during chemical mechanical polishing
Siwen Lu, Jingjing Xia, Jun Yu, Zhanshan Wang
Topics & Concepts
Materials scienceWaferPolishingChemical-mechanical planarizationMechanism (biology)SiliconComposite materialMetallurgyForensic engineeringNanotechnologyEngineeringEpistemologyPhilosophyAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure AnalysisAdvanced machining processes and optimization