Multiband Electromagnetic Interference Shielding Composite with Dynamic Thermal Management and Passive Infrared Stealth Performance
Jie Mei, Huimin Liao, Siqi Yang, Mingtai Liu, Hao Tu, Jian Wang
Abstract
With the rapid advancement of modern communication and infrared detection technologies, there is an urgent demand in military protection for multiband electromagnetic interference (EMI) shielding materials integrated with infrared stealth capabilities. Traditional passive infrared stealth strategies relying on thermal resistance materials and low infrared emissivity coatings often fail to achieve stable temperature regulation in complex environments, leading to target exposure due to thermal contrasts. To address this, we developed an innovative PF@Ag-MF@Ag-x composite via an electroless plating process. By constructing a continuous conductive network through silver layer growth on a three-dimensional framework, the composite couples the unique electronic properties of silver with multiscale heterogeneous interfaces, achieving exceptional broadband EMI shielding effectiveness of 92.3 dB (X band) and 90.1 dB (Ku band). The hierarchical pore structure synergizes with low infrared emissivity to enable efficient passive infrared stealth by suppressing heat conduction and radiation. Furthermore, a dual-mode electrothermal conversion mechanism, combined with plasmon resonance effects, allows active temperature modulation for adaptive infrared camouflage through dynamic environmental thermal matching. This composite integrates multiband electromagnetic protection with active-passive infrared stealth, offering an innovative solution for all-weather electromagnetic/infrared integrated protection in military equipment.