A novel bright additive for copper electroplating: electrochemical and theoretical study
Yaqiang Li, Penghui Ren, Ruopeng Li, Yuanhang Zhang, Jinqiu Zhang, Peixia Yang, Maozhong An
Topics & Concepts
CopperElectroplatingNucleationMaterials scienceChronoamperometryElectrochemistryCyclic voltammetryNanocrystalline materialCoatingCopper platingDiffusionCurrent densityChemical engineeringGrain sizeMetallurgyAnalytical Chemistry (journal)NanotechnologyChemistryElectrodeLayer (electronics)Physical chemistryThermodynamicsEngineeringOrganic chemistryChromatographyQuantum mechanicsPhysicsElectrodeposition and Electroless CoatingsCorrosion Behavior and InhibitionElectronic Packaging and Soldering Technologies