Corrosion control of copper wiring by barrier CMP slurry containing azole inhibitor: Combination of simulation and experiment
Tengda Ma, Baimei Tan, Yi Xu, Da Yin, Guorui Liu, Nengyuan Zeng, Guoqiang Song, Zhengxiao Kao, Yuling Liu
Topics & Concepts
Chemical-mechanical planarizationCorrosionCopperCorrosion inhibitorElectrochemistryMaterials scienceAdsorptionErosion corrosion of copper water tubesSlurryPolishingBarrier layerChemical engineeringChemistryLayer (electronics)MetallurgyComposite materialElectrodeOrganic chemistryPhysical chemistryEngineeringAdvanced Surface Polishing TechniquesCorrosion Behavior and InhibitionIntegrated Circuits and Semiconductor Failure Analysis