State-of-the-art of the bond wire failure mechanism and power cycling lifetime in power electronics
Luhong Xie, Erping Deng, Shaohua Yang, Ying Zhang, Yan Zhong, Yanhao Wang, Yongzhang Huang
Topics & Concepts
Wire bondingReliability (semiconductor)ElectronicsPower electronicsBondMaterials sciencePower (physics)Composite materialStructural engineeringElectrical engineeringEngineeringVoltagePhysicsQuantum mechanicsChipFinanceEconomicsSilicon Carbide Semiconductor TechnologiesElectronic Packaging and Soldering TechnologiesElectromagnetic Compatibility and Noise Suppression