A supersaturated Cu-Ag nanoalloy joint with ultrahigh shear strength and ultrafine nanoprecipitates for power electronic packaging
Wenwu Zhang, Penghao Zhang, Dashi Lu, Hao Pan, Xiangli Liu, Cheng‐Yan Xu, Jun Wei, Mingyu Li, Hongjun Ji
Topics & Concepts
Materials scienceShear strength (soil)Grain boundarySevere plastic deformationComposite materialElectronic packagingGrain sizeNanoparticleMetallurgyMicrostructureNanotechnologyEnvironmental scienceSoil scienceSoil waterElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesElectrodeposition and Electroless Coatings