Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices
Alice Lassnig, Velislava L. Terziyska, Jakub Zálešák, Tanja Jörg, Daniel M. Toebbens, Thomas Grießer, Christian Mitterer, Reinhard Pıppan, Megan J. Cordill
Abstract
for the films with the highest amount of nanosized grains. This surprising result could be clarified using an additional study of the buckles using focused ion beam cutting and quantification via confocal laser scanning microscopy to decouple and quantify the amount of elastic and plastic deformation stored in the buckled thin film. It could be shown that the films with smaller grains exhibit the possibility of absorbing a higher amount of energy during delamination, which explains their higher adhesion energy.
Topics & Concepts
Materials scienceComposite materialThin filmMicrostructureBrittlenessSputter depositionSputteringNanotechnologyMetal and Thin Film MechanicsCopper Interconnects and ReliabilityAdvanced Surface Polishing Techniques