Coupling dynamic thermal analysis and surface modification to enhance heat dissipation of R410A spray cooling for high-power electronics
Shangming Wang, Zhifu Zhou, Xuehao Sang, Bin Chen, Alexandros Romeos, Athanasios Giannadakis, Thrassos Panidis
Topics & Concepts
Materials scienceHeat transfer coefficientHeat transferSubcoolingFinCritical heat fluxHeat transfer enhancementElectronics coolingThermodynamicsEnhanced heat transferHeat fluxMechanicsCoupling (piping)Cooling capacityComposite materialPhysicsFluid Dynamics and Heat TransferHeat Transfer and OptimizationElectrohydrodynamics and Fluid Dynamics