Direct Laser Interference Ink Printing Using Copper Metal–Organic Decomposition Ink for Nanofabrication
Jun-Han Park, Jung-Woon Lee, Yong-Won Ma, Bo-Seok Kang, Sung-Moo Hong, Bo-Sung Shin
Abstract
In this study, we developed an effective and rapid process for nanoscale ink printing, direct laser interference ink printing (DLIIP), which involves the photothermal reaction of a copper-based metal-organic decomposition ink. A periodically lined copper pattern with a width of 500 nm was printed on a 240 μm-wide line at a fabrication speed of 17 mm/s under an ambient environment and without any pre- or post-processing steps. This pattern had a resistivity of 3.5 μΩ∙cm, and it was found to exhibit a low oxidation state that was twice as high as that of bulk copper. These results demonstrate the feasibility of DLIIP for nanoscale copper printing with fine electrical characteristics.