Atomic insight on the electronic structure and interfacial bonding characterization of the Cu/TiC interface
Haimin Ding, Wenchao Jin, Fugong Qi, Qing Liu, Qiwen Qiu
Topics & Concepts
Materials scienceUltimate tensile strengthComposite materialAlloyMetalCeramicCovalent bondPhase (matter)StoichiometryCopperMetallurgyPhysical chemistryQuantum mechanicsOrganic chemistryPhysicsChemistryAluminum Alloys Composites PropertiesAdvanced ceramic materials synthesisAdvanced materials and composites