Alternative insulation liners for through-silicon vias: A comprehensive review
Miao Tian, Xiaokun Gu
Topics & Concepts
InterconnectionReliability (semiconductor)Materials scienceThrough-silicon viaSiliconThermal insulationMechanical engineeringEngineering physicsComputer scienceNanotechnologyOptoelectronicsEngineeringLayer (electronics)TelecommunicationsPhysicsPower (physics)Quantum mechanics3D IC and TSV technologiesSemiconductor materials and devicesElectronic Packaging and Soldering Technologies