Surface action mechanism and planarization effect of sarcosine as an auxiliary complexing agent in copper film chemical mechanical polishing
Jiakai Zhou, Xinhuan Niu, Chenghui Yang, Zhaoqing Huo, Yanan Lu, Zhi Wang, Yaqi Cui, Ru Wang
Topics & Concepts
Chemical-mechanical planarizationCopperSlurryPolishingMaterials scienceChemical engineeringX-ray photoelectron spectroscopySarcosineIsotropic etchingRaman spectroscopyDissolutionChemistryNanotechnologyMetallurgyEtching (microfabrication)Composite materialGlycineLayer (electronics)EngineeringPhysicsAmino acidBiochemistryOpticsAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure AnalysisMetal Extraction and Bioleaching