Flow boiling of HFE-7100 for cooling Multi-Chip modules using manifold microchannels
Xiangbo Huang, Weiyu Tang, Zan Wu, Yifan Wang, Li Luo, Kuang Sheng
Topics & Concepts
Flow boilingBoilingChipMaterials scienceFlow (mathematics)Manifold (fluid mechanics)MechanicsLab-on-a-chipMechanical engineeringMicrofluidicsHeat transferThermodynamicsNanotechnologyEngineeringCritical heat fluxPhysicsElectrical engineeringHeat transfer coefficientHeat Transfer and OptimizationHeat Transfer and Boiling StudiesHeat Transfer Mechanisms