Short fatigue crack growth sensitivity to thermo-mechanical fatigue loading
Nicolas Leost, Djamel Missoum-Benziane, Matthieu Rambaudon, Laurent Cameriano, François Comte, Brice Le Pannerer, Vincent Maurel
Abstract
Most high-temperature components are subject to out-of-phase thermomechanical fatigue (OP-TMF), which induces crack growth at low temperatures. However, OP-TMF has been little studied in the context of short cracks. This study focuses on the experimental sensitivity of OP-TMF loading conditions playing on temperature range, gradient, and dwell time for thin sheet superalloy specimens. The material of interest is a Co-based superalloy, HA188. It is widely used in combustion chambers. The experimental analysis is based on full-field measurements for temperature, strain and damage by infrared thermography, digital image correlation and high resolution images from 300 to 900 °C. The main conclusion is that the temperature gradient, together with the temperature amplitude, largely determines the strain amplitude and subsequent fatigue crack growth rate (FCGR) of short cracks. In situ measurements of damage and crack closure were obtained using supervised machine learning based on images. This clarifies that crack closure is only partial and that the crack network growth rate is consistent with the individual short crack growth rate. Finally, 3D finite element analysis considering realistic temperature field and strain energy based FCGR model was able to evaluate the fatigue life in this context. It is shown that the OP-TMF FCGR is very close to the FCGR of the maximum temperature of the TMF cycle due to partial crack closure. • TMF loading parameters have been varied in both temperature amplitude and gradient. • These temperature parameters drive the strain amplitude. • Short crack growth is sensitive to strain amplitude for a given maximum temperature. • Supervised machine learning yields access to in situ crack closure analysis. • Fatigue crack growth rate is similar for OP-TMF and maximum temperature isothermal testing.