Flexible Copper–Graphene Nanoplates on Ceramic Supports for Radiofrequency Electronics with Electromagnetic Interference Shielding and Thermal Management Capacity
Alireza Jalouli, Saurabh Khuje, Aaron Sheng, Abdullah Islam, Massimigliano Di Luigi, Donald Petit, Zheng Li, Chenggang Zhuang, Lanrik Kester, Jason N. Armstrong, Jian Yu, Shenqiang Ren
Abstract
Flexible electronics for harsh and hazardous environments could offer a broad range of technological applications from conformal structural health monitoring, hypersonics, to telecommunication systems. However, advanced materials with the capability of additive manufacturing and the tolerance to extreme operating conditions are imperative. Here, we report high-temperature radiofrequency electronics with thermal management by printing copper hybrid conductors onto flexible thin alumina ribbon ceramic and ceramic fiber/silica aerogel composite. Regulating thermal stability, tuning resonance frequency, and increasing current-carrying ability of printed electronics are synergistically achieved using a flexible thermal-insulation ceramic fiber/silica aerogel composite or thermally conductive alumina ribbon ceramic substrates and high-temperature copper–graphene conductors. The printed copper conductor coatings exhibit tunable antenna resonance and electromagnetic interference effectiveness of 70 dB at a thickness of 5 μm, opening a pathway toward flexible hybrid radiofrequency electronics with thermal management.