Litcius/Paper detail

Plasma-assisted polishing with silicon and silica plates: Comparison of interaction mechanism and achievement of atomically flat surfaces on single- and polycrystalline diamond

Jiayuan Dong, Sota Sugihara, Kafumi Fujiwara, Rongyan Sun, Yuji Ohkubo, Junsha Wang, Tadatomo Suga, Kazuya Yamamura

2025Journal of Materials Processing Technology7 citationsDOI

Topics & Concepts

PolishingDiamondMaterials scienceChemical-mechanical planarizationSiliconComposite materialX-ray photoelectron spectroscopyOxidizing agentMachiningAbrasiveSilicon carbidePolycrystalline diamondCarbon fibersTribologyPlasmaMetallurgyNanotechnologyDeformation (meteorology)Material properties of diamondChemical engineeringCrystalline siliconIrradiationAbrasive machiningDiamond toolContext (archaeology)Surface modificationDiamond cuttingAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchLaser Material Processing Techniques
Plasma-assisted polishing with silicon and silica plates: Comparison of interaction mechanism and achievement of atomically flat surfaces on single- and polycrystalline diamond | Litcius