Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse
Jinwoo Kim, Gauthaman Murali, Heechun Park, Eric Qin, Hyoukjun Kwon, Venkata Chaitanya Krishna Chekuri, Nael Mizanur Rahman, Nihar Dasari, Arvind Singh, Minah Lee, Hakki Mert Torun, Kallol Roy, Madhavan Swaminathan, Saibal Mukhopadhyay, Tushar Krishna, Sung Kyu Lim
Abstract
A new trend in system-on-chip (SoC) design is chiplet-based IP reuse using 2.5-D integration. Complete electronic systems can be created through the integration of chiplets on an interposer, rather than through a monolithic flow. This approach expands access to a large catalog of off-the-shelf intellectual properties (IPs), allows reuse of them, and enables heterogeneous integration of blocks in different technologies. In this article, we present a highly integrated design flow that encompasses architecture, circuit, and package to build and simulate heterogeneous 2.5-D designs. Our target design is 64core architecture based on Reduced Instruction Set Computer (RISC)-V processor. We first chipletize each IP by adding logical protocol translators and physical interface modules. We convert a given register transfer level (RTL) for 64-core processor into chiplets, which are enhanced with our centralized network-onchip. Next, we use our tool to obtain physical layouts, which is subsequently used to synthesize chip-to-chip I/O drivers and these chiplets are placed/routed on a silicon interposer. Our package models are used to calculate power, performance, and area (PPA) and reliability of 2.5-D design. Our design space exploration (DSE) study shows that 2.5-D integration incurs 1.29× power and 2.19× area overheads compared with 2-D counterpart. Moreover, we perform DSE studies for power delivery scheme and interposer technology to investigate the tradeoffs in 2.5-D integrated chip (IC) designs.