Recent progress and challenges of photosensitive polyimides in advanced packaging: Technology beyond limit
Laraib Sajjad, Ruhan E. Ustad, Vijay D. Chavan, Zulfqar Ali Sheikh, Ajay T. Avatare, Muhammad Farooq Khan, Honggyun Kim, Deok‐kee Kim
Topics & Concepts
MicroelectronicsNanotechnologyEngineering physicsMaterials scienceComputer scienceEmerging technologiesSemiconductor materialsElectronic packagingIntegrated circuit packagingKey (lock)SemiconductorLimit (mathematics)Systems engineeringBiocompatible materialEngineeringThermal management of electronic devices and systemsElectrical engineeringLead (geology)Semiconductor deviceSynthesis and properties of polymersSilicone and Siloxane ChemistryEpoxy Resin Curing Processes