Ultrasonic-assisted surface roughening of glass substrate to improve adhesion of electroless nickel seed layer in microsystems packaging
Vishnu Kant Bajpai, Harsh Pandey, Tarlochan Singh, Pradeep Dixit
Topics & Concepts
Materials scienceCopperLayer (electronics)AdhesionComposite materialNickelElectroplatingSurface roughnessSubstrate (aquarium)Surface finishAbrasiveUltrasonic sensorMetallurgyAcousticsOceanographyPhysicsGeologyElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering TechnologiesMaterial Properties and Processing