Grain size stability of interfacial intermetallic compound in Ni and Co nanoparticle-doped SAC305 solder joints under electromigration

Muhammad Nasir Bashir, A.S.M.A. Haseeb

2022Journal of Materials Science Materials in Electronics18 citationsDOI

Topics & Concepts

Materials scienceIntermetallicSolderingElectromigrationGrain sizeMetallurgyCathodeElectron backscatter diffractionComposite materialAnodeDopingGrain boundaryScanning electron microscopeMicrostructureElectrodeAlloyChemistryOptoelectronicsPhysical chemistryElectronic Packaging and Soldering TechnologiesCopper Interconnects and ReliabilityElectrodeposition and Electroless Coatings